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Plastic Electronics

R&D

Plastic Electronics or Plastronics is a new discipline that includes the integration of electronic components in plastic materials, the use of electrically conductive polymers as well as the development of flexible electronics by printing electronic circuits with conductive inks on polymeric films.

These technologies enable plastic products with integrated electronics to be produced using plastic transformation processes, such as thermoforming and injection or 3D printing. Plastic sensors or tactile parts can also be produced.

In this way, lightweight and flexible components that can be integrated into products with complex geometries can be produced and manufactured on a large scale.

At GAIKER, we are researching the following lines:

Formulation

Formulation of materials with electronic functionality, resistive and piezoresistive conductors and sensors.

Dispersion
- Liquid: Coatings and inks
- Molten: Pellets
Processes
- Lamination
- 3D Printing
- Injection
Functionalities
- Electrical, thermal conductivity
- Sensors
  - Capacitive
  - Resistive
  - Piezoresistive
  - Magnetic

Integration

Integration of non-printed components in plastic materials. Insertion of LED’s and other components into plastic parts.
2D functional printing for electronics.
- Screen printing 
- Rotogravure
Integration of functional materials using 2D printing.
Functional 3D Printing.
- Integration of functional materials using 3D printing.
- Development of materials for FDM.
- Modification of the printing process. Hybrid Processes.
In Mould Electronics (IME). Thermoforming and overmoulding by injection.
Deposition of conductive coatings/inks/pastes by screen printing, rotogravure, slot-die coating, and other “roll to roll” techniques.
- Electrode preparation 
- Conductive coatings

Services

Major Projects

Investigación en nuevos materiales y procesos para una electrónica impresa integrada y sostenible. IDEA III

El objetivo de este proyecto es incrementar la I+D en materiales y procesos para asegurar poder disponer en la CAPV del conocimiento y capacidades suficientes en tecnologías de impresión de electrónica 3D, pero además cuidando la sostenibilidad de los materiales y productos finales.

Subvencionado por el Gobierno Vasco

Haptic printed and patterned interfaces for sensitive surfaces. HAPPINESS

In the HAPPINESS project, prototypes demonstrating new surfaces with improved human-computer interaction, particularly in the automotive market, were developed through the integration of electronics in the plastic material transformation processes.

Research and development on 3D printing and integration of electronics. IDEA II

The main aim of this project is to develop new materials and printing and integration processes in order to create true printed electronics that make it possible to produce personalised, functional products in a single manufacturing process. Research is being carried out into 3D printing processes such as fused deposition modelling (FDM) and integration technologies such as in mould electronics (IME), which makes it possible to combine 2D flexible electronics printing with thermoforming and injection moulding to create 3D products with embedded electronics in plastic parts and 3D components.

Subsidised by the Basque Government

Piezoresistive thermoplastic matrix materials for improved sensor integration in injection moulding and additive manufacturing products. POLYSENSOR

This project focuses on using piezoresistive polymer matrix sensors as a strain sensor to study their ability to be transformed by FDM additive manufacturing processes and the injection moulding process.